Home > Thermal gap pad > DTA series Thermal silicon pad with adhesive

[Return Home] [Go Back]

DTA series Thermal silicon pad with adhesive



Product Description

DTA series Thermal silicon pad with adhesive

The DTA series is adhesive thermal conductive silicon pad, mainly for the thermal conductivity between the heating device and the heat sink or the product outer covings without fastening devices.

Features & benefits:
●Ultra-stickiness
●Without fastening devices
●Electrically isolating
● Meet with the environmental requirements of ROHS and UL

Typical applications:
●LED light
●Power conversion equipment
●Between the semiconductor or magnetic body and heat sink
●HID ballast
●Household appliances

Physical properties:

Test item

Test method

Unit

DTA150 Test value

Color

Visual

 

Grey

Thickness

ASTM D374

Mm

0.5 to 13

Specific Gravity

ASTM D792

g/cc

1.8±0.1

Hardness

ASTM D2240

Shore C

20 to 50

Tensile Strength

ASTM D412

kg/cm2

8

ASTM D412

Pa

5.88*109

Continuous Use Temp

EN 344

-40 to +220

Volume Resistivity

ASTM D257

Ω-CM

1.0*1011

Breakdown Voltage

ASTM D149

KV/mm

4

Flame Rating

UL-94

 

V-0

Conductivity

ASTM D5470

w/m-k

1.5

Configurations available: 200mm*400mm, 300mm*300mm, customized size available.

Related Products

Contact Us