DTP thermal conductive silicon pad

DTP thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer coving. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for HC series, which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect. compared to common thermal conductive & insulating materials, DTP series has certain stickiness which bring great convenience in the product installation processing, not easy to fall off and easy to operate.

Features & benefits:
●High reliability & High thermal conductivity
●High compressibility, soft and flexible
●Natural stickiness, no extra surface frontal adhesives
● Meet with the environmental requirements of ROHS and UL

Typical applications:
●Communication equipment               ●Mobile equipment              ●LED Light
●Video equipment                                  ●Switching power supply    ●Networking equipment
●Back light model                                  ●Household appliances      ●Medical equipment      ●PC server/workstations

Physical properties:

Configuration available: 200mm*400mm, 300mm*300mm, customized size available.