DTS series thermal silicon pad

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Product Name:
DTS series thermal silicon pad
Model No.:
DTS

Product Description

DTS series thermal silicon pad

The DTS series silicon pad is cloth production which made by special process with the base material-silicon gel and fiberglass, because of its nice thermal conductivity, insulation and convenient assembly, it’s widely used in electronic appliances industry. According to the size of the fever interface and theheight of the clearance select different thickness of the thermal conductive silicon tape cut zhe pad into differentsizes, and put the silicon tap in the gap between the fever interface and their components to play as an heat-conducting medium.

Key property:
●Heat resistance, insulation, fire prevention, shock resistance .

Typical application:
●Heating power components, Automobile electronic heating module, Power module, Household appliances, Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate.

Physical properties:

Test item	Test method	Unit	Test value of DTS series
Test item	Test method	Unit	DTS-23	DTS-30	DTS-45	DTS-80
Color	Visual		Pink/Grey	Grey	Grey	Grey
Thickness	ASTM D374	Mm	0.23±0.03	0.3±0.03	0.45±0.03	0.8±0.03
Specific Gravity	ASTM D792	g/cc	1.6 to 1.8	1.6 to 1.8	1.6 to 1.8	1.6 to 1.8
Hardness	ASTM D2240	Shore A	80 to 90	80 to 90	80 to 90	80 to 90
Tensile Strength	ASTM D412	kg/cm2	>180	>180	>180	>180
Tensile Strength	ASTM D412	pa	1.8*1011	1.8*1011	1.8*1011	1.8*1011
Continuous use Temp		℃	-50 to +200	-50 to +200	-50 to +200	-50 to+200
Elongation	ASTM D412	%	3 to 8	3 to 8	3 to 8	3 to 8
Breakdown Voltage	ASTM D149	KV/mm	≥3.0	≥4.0	≥5.0	≥8.0
Flame Rating	UL-94		V-0	V-0	V-0	V-0
Conductivity	ASTM D5470	w/m-k	1.0 to 1.5	1.0 to 1.5	1.0 to 1.5	1.0 to 1.5

Configurations available: 300mm*50M per roll, customized sheet, die-cut form.

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