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TO series thermal silicon pad



Product Description

TO series thermal silicon pad

The TO series silicon pad is cloth production which made by special process with the base material--silicon gel and fiberglass, because of its nice thermal conductivity, insulation and convenient assembly, it’s widely used in electronic appliances industry. According to the size of the fever interface and the height of the clearance select different thickness of thethermal conductive silicon tape cut zhe pad into different sizes, and put the silicon tap in the gap between the fever interface and their components to play as an heat-conducting medium.

Key property:
●Heat resistance, insulation, fire prevention, shock resistance .
Typical application:
●Heating power components, Automobile electronic heating module, Power module, Household appliances, Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate.

Physical properties:


Test Item

Test value

Unit

Test method

Color

Grey

-

Visual

Specific gravity

1.7±0.1

g/cm2

ASTMD792

Hardness

75±5

shore

ASTMD2240

Voltage Endurance

≥4.0

Kv/mm

ASTMD149

Continuous use Temp

-50~+200

EN344

Thetmal Conductivity

1.0 to 1.5

w/m-k

ASTMD5470

Flame Rating

V-0

 

UL-94

Vloume Resistivity

≥1012

Ω-¬cm

ASTMD257

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